Title

Data mining of printed-circuit board defects

Document Type

Article

Peer Reviewed

1

Publication Date

1-1-2001

Journal/Book/Conference Title

Robotics and Automation, IEEE Transactions on

Volume

17

Abstract

This paper discusses an industrial case study in which data mining has been applied to solve a quality engineering problem in electronics assembly. During the assembly process, solder balls occur underneath some components of printed circuit boards. The goal is to identify the cause of solder defects in a circuit board using a data mining approach. Statistical process control and design of experiment approaches did not provide conclusive results. The paper discusses features considered in the study, data collected, and the data mining solution approach to identify causes of quality faults in an industrial application

Keywords

Sustainability, This paper discusses an industrial case study in which data mining has been applied to solve a quality engineering problem in electronics assembly. During the assembly process, solder balls occur underneath some components of printed circuit boards. The goal is to identify the cause of solder defects in a circuit board using a data mining approach. Statistical process control and design of experiment approaches did not provide conclusive results. The paper discusses features considered in the study, data collected, and the data mining solution approach to identify causes of quality faults in an industrial application

Published Article/Book Citation

Robotics and Automation, IEEE Transactions on, 17:2 (2001) pp.191-196.



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URL

http://ir.uiowa.edu/cee_pubs/359